C10100 OFE Oxygen-Free Copper Plate
Copper plate is a highly stable, low maintenance roofing and curtain wall material that is environmental, safe to use, easy to process and highly resistant to corrosion. A stable protective layer allows the life of the copper plate to exceed 100 years. The economic performance of copper plate is one of the best metal roofing materials.
1) The yield strength of the copper plate is inversely proportional to the elongation. The hardness of the copper plate after bending processing is extremely high, but it can be reduced by heat treatment.
2) Among all the metal materials used in construction, copper has the best extension properties and has great advantages in architectural modeling.
3) The copper plate is not limited by the processing temperature, and is not brittle at low temperature, and can be hot-melt welded by oxygen blowing at a high melting point.
| Copper Plates - Detailed Technical Specifications | |||
| Common Copper Plate Grades and Classifications | |||
| UNS No. | Previous Designation | Type of Copper | Key Characteristics |
| C10100 | OFE | Oxygen-free electronic | Highest purity (≥99.99%); exceptionally high conductivity; no oxygen embrittlement; suitable for critical electronic applications |
| C10200 | OF | Oxygen-free without residual deoxidants | Cu ≥ 99.95%; no oxygen; excellent conductivity; reduced embrittlement risk; good welding performance |
| C10300 | OFXLP | Oxygen-free extra low phosphorus | High purity with minimal phosphorus content; good mechanical properties |
| C10400, C10500, C10700 | OFS | Oxygen-free, silver bearing | Oxygen-free with silver addition; improved high-temperature properties |
| C10800 | OFLP | Oxygen-free low phosphorus | Low phosphorus content; good ductility |
| C10910 | / | Low oxygen | Lower oxygen content than ETP; alternative grade |
| C11000 | ETP, TPC | Electrolytic tough pitch, Tough pitch | Cu+Ag ≥ 99.90%; contains oxygen (≤0.06%); excellent conductivity (≥100% IACS annealed); most common grade |
| C11300, C11400, C11600 | STP | Silver bearing tough pitch | Tough pitch with silver addition; improved creep resistance |
| C12000 | DLP | Phosphorized, low residual phosphorus | Phosphorus deoxidized; good weldability |
| C12200 | DHP | Phosphorized, high residual phosphorus | Cu ≥ 99.85%; P 0.015-0.040%; excellent weldability; good corrosion resistance; conductivity ~79-96% IACS |
| C12300 | DHPS | Phosphorized, silver bearing | Phosphorized with silver addition |
| C14200 | DPA | Phosphorus deoxidized, arsenical | Arsenic addition; improved corrosion resistance |
| C14420 | / | Tin bearing tellurium copper | Tin and tellurium addition; improved machinability |
| C14530 | / | Tin tellurium bearing copper | Tin and tellurium addition |
| Dimensional Specifications for Copper Plates | |||
| Parameter | Range | Notes | |
| Thickness Range | 0.1 mm – 120 mm | Plate defined as thickness ≥ 0.25 in (6.35 mm); sheet ≤ 0.25 in | |
| Width Range | Up to 36 in (914 mm) | Standard widths available; custom widths upon request | |
| Length Range | Up to 96 in (2440 mm) | Standard lengths; custom lengths available | |
| Standard | ASTM B152 / B152M | Applicable to all listed copper grades | |
| Surface Finishes Available | |||
| Finish Type | Description | Applications | |
| Mill | As-rolled; standard finish; may have mill scale | General industrial applications | |
| Polished | Smooth, reflective surface | Decorative applications, precision components | |
| Bright | Bright annealed surface | High-end electrical applications | |
| Oiled | Surface oiled for corrosion protection | Storage and transit protection | |
| Hair Line | Brushed finish with fine lines | Architectural applications | |
| Brush | Brushed surface finish | Decorative applications | |
| Mirror | Highly reflective polished finish | Decorative applications | |
| Sand Blast | Textured matte finish | Decorative and industrial applications | |
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