C12000 C12200 Copper Plate
General Description C12200, Phosphorus deoxidised copper, has been made weldable and brazeable by deoxidising with phosphorus. It is widely used as flat products and tubing, especially where it is to be welded or brazed. Phosphorus significantly reduces the conductivity, which may go as low as 70% IACS, but also raises the softening temperature when work hardened and promotes fine grain size.
Product Description
| Copper Plates - Detailed Technical Specifications | |||
| Common Copper Plate Grades and Classifications | |||
| UNS No. | Previous Designation | Type of Copper | Key Characteristics |
| C10100 | OFE | Oxygen-free electronic | Highest purity (≥99.99%); exceptionally high conductivity; no oxygen embrittlement; suitable for critical electronic applications |
| C10200 | OF | Oxygen-free without residual deoxidants | Cu ≥ 99.95%; no oxygen; excellent conductivity; reduced embrittlement risk; good welding performance |
| C10300 | OFXLP | Oxygen-free extra low phosphorus | High purity with minimal phosphorus content; good mechanical properties |
| C10400, C10500, C10700 | OFS | Oxygen-free, silver bearing | Oxygen-free with silver addition; improved high-temperature properties |
| C10800 | OFLP | Oxygen-free low phosphorus | Low phosphorus content; good ductility |
| C10910 | / | Low oxygen | Lower oxygen content than ETP; alternative grade |
| C11000 | ETP, TPC | Electrolytic tough pitch, Tough pitch | Cu+Ag ≥ 99.90%; contains oxygen (≤0.06%); excellent conductivity (≥100% IACS annealed); most common grade |
| C11300, C11400, C11600 | STP | Silver bearing tough pitch | Tough pitch with silver addition; improved creep resistance |
| C12000 | DLP | Phosphorized, low residual phosphorus | Phosphorus deoxidized; good weldability |
| C12200 | DHP | Phosphorized, high residual phosphorus | Cu ≥ 99.85%; P 0.015-0.040%; excellent weldability; good corrosion resistance; conductivity ~79-96% IACS |
| C12300 | DHPS | Phosphorized, silver bearing | Phosphorized with silver addition |
| C14200 | DPA | Phosphorus deoxidized, arsenical | Arsenic addition; improved corrosion resistance |
| C14420 | / | Tin bearing tellurium copper | Tin and tellurium addition; improved machinability |
| C14530 | / | Tin tellurium bearing copper | Tin and tellurium addition |
| Dimensional Specifications for Copper Plates | |||
| Parameter | Range | Notes | |
| Thickness Range | 0.1 mm – 120 mm | Plate defined as thickness ≥ 0.25 in (6.35 mm); sheet ≤ 0.25 in | |
| Width Range | Up to 36 in (914 mm) | Standard widths available; custom widths upon request | |
| Length Range | Up to 96 in (2440 mm) | Standard lengths; custom lengths available | |
| Standard | ASTM B152 / B152M | Applicable to all listed copper grades | |
| Surface Finishes Available | |||
| Finish Type | Description | Applications | |
| Mill | As-rolled; standard finish; may have mill scale | General industrial applications | |
| Polished | Smooth, reflective surface | Decorative applications, precision components | |
| Bright | Bright annealed surface | High-end electrical applications | |
| Oiled | Surface oiled for corrosion protection | Storage and transit protection | |
| Hair Line | Brushed finish with fine lines | Architectural applications | |
| Brush | Brushed surface finish | Decorative applications | |
| Mirror | Highly reflective polished finish | Decorative applications | |
| Sand Blast | Textured matte finish | Decorative and industrial applications | |
