C17500 CuCo2Be Beryllium Copper Plate
CuCo2Be-UNS.C17500 (Alloy 10) Cobalt Beryllium Copper
CuCo2Be—C17500 (CDA 175) Cobalt Beryllium Copper is primarily utilized in the industry applications that require most highly thermal or electrical conductivity, which features a cobalt alloying addition (2.40-2.70%). C17500 also Offers good strength and hardness characteristics coupled with conductivity in the range of 45-60 percent of copper with ultimate tensile and hardness properties approaching 140 ksi and RB 100 respectively.
Product Description
| Copper Plates - Detailed Technical Specifications | |||
| Common Copper Plate Grades and Classifications | |||
| UNS No. | Previous Designation | Type of Copper | Key Characteristics |
| C10100 | OFE | Oxygen-free electronic | Highest purity (≥99.99%); exceptionally high conductivity; no oxygen embrittlement; suitable for critical electronic applications |
| C10200 | OF | Oxygen-free without residual deoxidants | Cu ≥ 99.95%; no oxygen; excellent conductivity; reduced embrittlement risk; good welding performance |
| C10300 | OFXLP | Oxygen-free extra low phosphorus | High purity with minimal phosphorus content; good mechanical properties |
| C10400, C10500, C10700 | OFS | Oxygen-free, silver bearing | Oxygen-free with silver addition; improved high-temperature properties |
| C10800 | OFLP | Oxygen-free low phosphorus | Low phosphorus content; good ductility |
| C10910 | / | Low oxygen | Lower oxygen content than ETP; alternative grade |
| C11000 | ETP, TPC | Electrolytic tough pitch, Tough pitch | Cu+Ag ≥ 99.90%; contains oxygen (≤0.06%); excellent conductivity (≥100% IACS annealed); most common grade |
| C11300, C11400, C11600 | STP | Silver bearing tough pitch | Tough pitch with silver addition; improved creep resistance |
| C12000 | DLP | Phosphorized, low residual phosphorus | Phosphorus deoxidized; good weldability |
| C12200 | DHP | Phosphorized, high residual phosphorus | Cu ≥ 99.85%; P 0.015-0.040%; excellent weldability; good corrosion resistance; conductivity ~79-96% IACS |
| C12300 | DHPS | Phosphorized, silver bearing | Phosphorized with silver addition |
| C14200 | DPA | Phosphorus deoxidized, arsenical | Arsenic addition; improved corrosion resistance |
| C14420 | / | Tin bearing tellurium copper | Tin and tellurium addition; improved machinability |
| C14530 | / | Tin tellurium bearing copper | Tin and tellurium addition |
| Dimensional Specifications for Copper Plates | |||
| Parameter | Range | Notes | |
| Thickness Range | 0.1 mm – 120 mm | Plate defined as thickness ≥ 0.25 in (6.35 mm); sheet ≤ 0.25 in | |
| Width Range | Up to 36 in (914 mm) | Standard widths available; custom widths upon request | |
| Length Range | Up to 96 in (2440 mm) | Standard lengths; custom lengths available | |
| Standard | ASTM B152 / B152M | Applicable to all listed copper grades | |
| Surface Finishes Available | |||
| Finish Type | Description | Applications | |
| Mill | As-rolled; standard finish; may have mill scale | General industrial applications | |
| Polished | Smooth, reflective surface | Decorative applications, precision components | |
| Bright | Bright annealed surface | High-end electrical applications | |
| Oiled | Surface oiled for corrosion protection | Storage and transit protection | |
| Hair Line | Brushed finish with fine lines | Architectural applications | |
| Brush | Brushed surface finish | Decorative applications | |
| Mirror | Highly reflective polished finish | Decorative applications | |
| Sand Blast | Textured matte finish | Decorative and industrial applications | |
